Intel Unveils The Surface Neo S Low Power Tremont Cpu Architecture
To understand Tremont, it’s useful to know that the 10nm Lakefield will use a hybrid CPU architecture. It will house 4 Tremont cores with a single scalable Sunny Cove core and the Foveros 3D packaging technology. The technique could significantly alter the desirability of Intel when it comes to devices like tablets, phones, and IoT. The chipmaker is promising significant instructions per cycle (IPC) gains compared to its previous efforts....